USB 3.0 standard specifies a maximum transmission speed of up to 5 Gbit/s (625 MB/s), which is more than 10 times as fast as USB 2.0 (480 Mbit/s, or 60 MB/s. USB 3.0 reduces the time required for data transmission, reduces power consumption, and is backward compatible with USB 2.0. For USB 3.0, the voltage supplied by low-powered hub ports is 4.45–5.25
At Gigabits speed, high speed interconnects must be characterized along with RF board traces. Maintaining good signal quality throughout high-density and high-speed interconnects is crucial due to ever increasing demands for cleaner signal transmission. The requirement of a new high speed multi pin connector is to enable a data transmission at very high rate (~ 10Gbit/s ) in various systems . The connections should be point-to-point connections applying differential signal trace layout. In the design process it is necessary to obtain a realistic prediction of the overall system performance.
Interconnects can no longer be treated as an after-thought in the system design process. As rise times get shorter and clock frequencies faster, connectors and cables once considered electrically transparent can have a significant effect on a system’s transmitted signal. Factors such as crosstalk, return loss, attenuation, and electromagnetic interference can all play significant rolls in determining what interconnect solution is optimal for a given application. With rise times faster than about 1ns, many interconnects become a critical portion of the transmission path, and further analysis is often required.
EM simulated data is given here